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Poly Solar Panels Production Process

Shenzhen Shine Solar Co.,Ltd | Updated: May 31, 2017

Poly solar panels slice, cleaning, preparation of suede, peripheral etching, remove the back of the PN + knot, making the upper and lower electrodes, making anti-reflective film, sintering, test sub-file 10 steps.

Poly solar panels specific production process instructions

(1) Poly solar panel slices: the use of multi-line cutting, the silicon rods cut into square silicon.

(2) Poly solar panel cleaning: cleaning with conventional silicon cleaning method, and then use the acid (or alkali) solution to remove the surface of the silicon wafer damage layer removed 30-50um.

(3) Preparation of suede solar panels: Anisotropic etching of silicon wafers with alkali solution The suede was prepared on the surface of silicon wafers.

(4) poly solar panels phosphorus diffusion: the use of coating source (or liquid source, or solid phosphorus nitride plate source) for diffusion, made PN + junction, junction depth is generally 0.3-0.5um.

(5) Polarization of the solar panel: The diffusion layer formed on the peripheral surface of the silicon wafer during diffusion causes the battery upper and lower electrodes to be short-circuited, and the peripheral diffusion layer is removed by masking wet etching or plasma dry etching.

(6) Poly solar panels remove the back of the PN + junction. Commonly used wet etching or grinding method to remove the back of the PN + junction.

(7) poly solar panels made of upper and lower electrodes: vacuum deposition, electroless nickel or aluminum paste printing sintering process. The lower electrode was fabricated, and then the upper electrode was fabricated. Aluminum paste printing is a large number of process methods used.

(8) Poly solar panels to produce anti-reflective film: In order to reduce the loss of reflection, to the surface of the silicon film covered with a layer of anti-reflective film. Preparation of anti-reflective film materials are MgF2, SiO2, Al2O3, SiO, Si3N4, TiO2, Ta2O5 and so on. The method may be a vacuum coating method, an ion plating method, a sputtering method, a printing method, a PECVD method, or a spray coating method.

(9) Sintering: The battery chip is sintered on a base plate of nickel or copper.

(10) test sub-file: according to the provisions of the specification, test classification.


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